HX-1022 Three proof Adhesive Series
The main component of HX-1022 is polyurethane modified alkyd resin, which is a transparent benzene free solvent based three proof adhesive; It is mainly used on electronic and electrical circuit boards to provide coating protection for components, especially for PCBA solder joints, effectively protecting important components (such as SMD) from harsh environments such as moisture, salt spray, and mold, improving the high temperature resistance and electrical insulation performance of electronic and electrical appliances; No corrosion to components; Can be cured at low temperature.
List of Main Performance Parameters
| state |
project |
Parameter performance |
| Before curing |
appearance |
Light yellow to light brown transparent liquid |
| Specific gravity (25 ℃) |
0.80-0.90 |
|
| Solid content |
37%-45% |
|
| Viscosity (four cups coated/25 ℃) |
12-25 seconds |
|
| Curing and shaping |
Volume resistance (Ω cm) |
2.0*1015 |
| Surface resistance (Ω cm) |
2.6*1015 |
|
| Adhesion (Hundred grid knife) |
class a |
|
| Water absorption rate: Soak at 25 ℃ for 24 hours |
<0.5% |
|
| Pencil hardness |
3~4H |
|
| Dielectric strength (KV/mm) |
112 |
|
| Dielectric constant |
3.2 |
|
| Loss factor (1 MHz 25C) |
0.02 |
|
| High temperature resistance performance |
Capable of withstanding high temperatures of 134 ℃ with unchanged performance |
|
| Flame retardancy |
UL 94 V0 |
Yue Gong Wang An Bei No. 4419002005671